影响因子：8.067
DOI码：10.1039/c9tc01096c
发表刊物：J. Mater. Chem. C
摘要：Cu-based chalcogenides have attracted increasing attention as a potential thermoelectric material due to their unique structural features, high element abundance, and low toxicity. In this paper, a series of Cu1.8SbxSnyS compositions (0.01 < x < 0.04, 0.015 < y < 0.045) were prepared by a simple method combining mechanical alloying (MA) and spark plasma sintering (SPS). The results demonstrate that Sb/Sn co-doping can optimize the hole concentration and substantially improve the dimensionless figure of merit (ZT) of copper–sulfide Cu1.8S. The highest ZT, up to 1.2 at 773 K, was realized for the Cu1.8Sb0.02Sn0.03S sample and maintained a high power factor of 975 μW m−1 K−2. The reduction in thermal conductivity was linked to the heterogeneous phase of Cu12Sb4S13 and Cu4SnS4. Remarkably, after four testing cycles, the variation in ZT was less than 2%, indicating a good stability of the Sb/Sn co-doped Cu1.8S materials.
论文编号：J. Mater. Chem. C, 2019, 7, 4026-4031
文献类型：J
是否译文：否
发表时间：2019-02-26
收录刊物：SCI