一种基于倒装焊封装的甲烷传感器及其制备方法与应用

• Disigner of the Invention:丁恩杰,liuxiaowen,zhaoxiaohu,chengtingting
• Type of Patent:国内
• State of Patent:专利授权
• Application Number:201410607349.1
• Number of Inventors:5
• Service Invention or Not:no
• Application Date:2014-10-31
• Authorization Date:2016-12-07
• First Author:mahongyu