Patents
一种基于倒装焊封装的甲烷传感器
- Disigner of the Invention:丁恩杰,liuxiaowen,zhaoxiaohu,chengtingting
- Type of Patent:国际
- State of Patent:专利授权
- Application Number:201420646230.0
- Number of Inventors:5
- Service Invention or Not:no
- Application Date:2014-10-31
- Authorization Date:2015-02-11
- First Author:mahongyu
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