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一种用于高地温巷道物理模拟的相似材料
Release time:2020-10-30 Hits:Affilication of Author(s):矿业工程学院
Disigner of the Invention:顾斌,zhangyuan,程敬义,周长冰,刘建明
Type of Patent:国内
State of Patent:专利授权
Application Number:201410194102.1
Number of Inventors:6
Service Invention or Not:no
Application Date:2014-05-09
Authorization Date:2015-11-18
First Author:wanzhijun
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