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单裂隙微米级隙宽测量结构
Release time:2020-10-30 Hits:School Sign:第一单位
Disigner of the Invention:wanzhijun,chengjingyi,zhangyuan,熊路长,刘泗斐,张洪伟,顾斌
Type of Patent:国际
State of Patent:专利授权
Application Number:201920822702.6
Number of Inventors:8
Service Invention or Not:no
Application Date:2019-05-31
Authorization Date:2020-01-24
First Author:王骏辉
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