Thermal management and waste heat recovery of electronics enabled by highly thermoconductive aramid composites with bridge-type 1D/2D liquid-crystalline thermal conduction networks
- DOI码:10.1016/j.enconman.2021.114957
- 所属单位:低碳能源与动力工程学院
- 项目来源:自选课题
- 第一作者:么冰
- 合写作者:Hengheng Zhu,Yue Ding,Congcong Luo,Teng Chen,Jun Zhou,Ying Chen,Pengcheng Lin
- 论文类型:期刊论文
- 卷号:Volume 251, 114957
- 是否译文:否
- 发表时间:2022-01-01

