一种电渗透法降低黏性土黏附性的试验装置
- Affilication of Author(s):力学与土木工程学院
- Scope of patent:国内
- School Sign:第一单位
- Disigner of the Invention:zhaoshisen,李梓涵,liuricheng,景少森,尹威方,王宗昊,郝思豪文松,邱凯
- Type of Patent:国内
- State of Patent:专利授权
- Application Number:202310226078.4
- Service Invention or Not:no
- Application Date:2023-03-10
- Authorization Date:2023-11-03
- First Author:wanzeen
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