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Home > Scientific Research > Patents

一种多尺度晶粒细化TC4切削加工表层硬度预测方法

Release time:2022-05-25 Hits:

Type of Patent:Invent
 State of Patent:Pending patent
 Application Number:CN202110868229.7
 Number of Inventors:3
 Service Invention or Not:no
 Application Date:2021-07-30

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