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一种半桥和全桥子模块混合的MMC模型预测控制方法

  • Release time:2023-09-01
  • Hits:
  • School Sign: 

    第一单位
  • Disigner of the Invention: 

    郑曦,daipeng,杨连胜,李康
  • Type of Patent: 

    国内
  • State of Patent: 

    专利授权
  • Application Number: 

    201811196255.4
  • Number of Inventors: 

    5
  • Service Invention or Not: 

    no
  • Application Date: 

    2018-10-15
  • Publication Date: 

    2019-01-22
  • Authorization Date: 

    2020-05-15
  • First Author: 

    公铮