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微波封装系统集成建模与设计
- Release time:2023-08-24
- Hits:
Publisher:
中国矿业大学出版社（徐州）Supported By:
主管部门科技项目School Sign:
第一单位The First Author:
Xiangjun ZhangType of Works:
MonographPublication Design:
一级ISBN No.:
978-7-5646-1087-6Translated or Not:
noNumber of Words:
19Date of Publication:
2011-06-06