一种钻孔深层水平位移高密度测试方法

Release time:2023-11-28 Hits:

School Sign:第一单位

Disigner of the Invention:徐海旭,叶思哲,yinqian,wujiangyu,wuxiaosuo

Type of Patent:国内

State of Patent:专利授权

Application Number:202310234819.3

Service Invention or Not:no

Application Date:2023-03-13

Publication Date:2023-10-20

Authorization Date:2023-10-20

First Author:zhangqiang