一种基于无人机航拍成像的超深孔地质成像方法

Release time:2023-11-21 Hits:

School Sign:第一单位

Disigner of the Invention:陈超,金家万

Type of Patent:国内

State of Patent:专利授权

Application Number:202211232353.5

Service Invention or Not:no

Application Date:2022-10-10

Authorization Date:2023-09-26

First Author:xielixiang