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能够保证模拟巷道水渗流均匀的渗流套管与模拟巷道结构

Release time:2020-10-30 Hits:

Disigner of the Invention:wanzhijun,zhangyuan,王靖超,吴栋,他旭鹏,杨壮壮,王子琦

Type of Patent:国际

State of Patent:专利授权

Application Number:201920360665.1

Number of Inventors:8

Service Invention or Not:no

Application Date:2019-03-20

Authorization Date:2019-12-03

First Author:王骏辉

万志军

Gender:Male Education Level:With Certificate of Graduation for Doctorate Study Alma Mater:中国矿业大学 Main positions:中国煤炭学会开采专业委员会副主任兼秘书长 Degree:Doctor Status:在岗 School/Department:继续教育学院 Business Address:文昌校区教五楼 E-Mail: