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能够保证模拟巷道水渗流均匀的渗流套管与模拟巷道结构
Release time:2020-10-30 Hits:Disigner of the Invention:wanzhijun,zhangyuan,王靖超,吴栋,他旭鹏,杨壮壮,王子琦
Type of Patent:国际
State of Patent:专利授权
Application Number:201920360665.1
Number of Inventors:8
Service Invention or Not:no
Application Date:2019-03-20
Authorization Date:2019-12-03
First Author:王骏辉
Pre One:高温高压水压致裂夹持器
Next One:回压阀
万志军
Gender:Male
Education Level:With Certificate of Graduation for Doctorate Study
Alma Mater:中国矿业大学
Main positions:中国煤炭学会开采专业委员会副主任兼秘书长
Degree:Doctor
Status:在岗
School/Department:继续教育学院
Business Address:文昌校区教五楼
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