一种多尺度晶粒细化TC4切削加工表层硬度预测方法
- School Sign:第一单位
- Disigner of the Invention:刘战强,程龙,Cheng Yanhai
- Type of Patent:国内
- State of Patent:专利授权
- Application Number:202210402591.X
- Service Invention or Not:no
- Application Date:2022-04-18
- Publication Date:2022-11-29
- Authorization Date:2022-11-29
- First Author:wangqingqing