Paper Publications
Microstructure of Copper Film Fabricated by Ion Implantation-assisted Electroless Plating
- Affiliation of Author(s):材料与物理学院
- Funded by:国家自然科学基金项目
- First Author:Sui Yanwei
- Indexed by:Journal paper
- Document Code:paper_87261
- Translation or Not:no
- Date of Publication:2011-11-01