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Enhanced thermal performance of hybrid interface materials supported by 3D thermally conductive SiC framework
- Release time:2024-04-09
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DOI number:
10.1016/j.ceramint.2023.07.063Affiliation of Author(s):
低碳能源与动力工程学院Funded by:
国家自然科学基金项目First Author:
Deng, MinCo-author:
Zhao, Chengzhi,Li, Jinyang,shengnan,Chunyu Zhu,Rao, ZhonghaoIndexed by:
Journal paperDocument Code:
5b5bb2948cce6191018cd81c7aa524a9Volume:
v 49,n 19,p31175-31182ISSN No.:
02728842Translation or Not:
noDate of Publication:
2023-10-01