Thermal management of electronic components based on hierarchical microchannels and nanofluids

Release time:2024-05-30 Hits:

DOI number:https://doi.org/10.1016/j.tsep.2023.101910

Affiliation of Author(s):低碳能源与动力工程学院

Funded by:省、市、自治区科技项目

First Author:王雨薇

Co-author:李文竹,qicong,余杰

Indexed by:Journal paper

Document Code:5b5bb2948ccd28aa018ccd3d6e0e008a

Volume:42: 101910

ISSN No.:2451-9049

Translation or Not:no

Date of Publication:2023-05-18