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Effects of heat sink structure on heat transfer performance cooled by semiconductor and nanofluids
Release time:2021-09-28 Hits:DOI number:https://doi.org/10.1007/s11814-020-0634-y
Affiliation of Author(s):低碳能源与动力工程学院
Funded by:省、市、自治区科技项目
First Author:qicong
Co-author:陈田田,涂江林,王宇星
Indexed by:Journal paper
Document Code:5b5bb294763c387701763ffb3e161667
Volume:37(12): 2104-2116
ISSN No.:1975-7220
Translation or Not:no
Date of Publication:2020-10-27