Stress reduction mechanism of diamond-like carbon films incorporated with different Cu contents
- Journal:Thin Solid Films
- First Author: Xiaowei Li#,Peng Guo#
- Co-author: Peiling Ke, Rende Chen,Lili Sun
- Correspondence Author:Aiying Wang*
- Volume:640
- Page Number:45-51
- Translation or Not:no
- Date of Publication:2017-10-31