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爆炸焊接记忆合金Ni50Ti50与Cu界面的扩散机理
- Release time:2023-08-25
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Affiliation of Author(s):
力学与土木工程学院Funded by:
国家自然科学基金项目First Author:
Ting LawCo-author:
申涛,向俊庠Indexed by:
Journal paperDocument Code:
5b5bb294757e67c2017583dc4e1502f7Volume:
2018年10期:3238-3242,5ISSN No.:
1002-185XTranslation or Not:
noDate of Publication:
2018-10-15