Enhancement of interfacial thermal conductance at semiconductor/polymer interfaces induced by intercalating water layer in humidity environment

Release time:2023-10-24 Hits:

DOI number:10.16791/j.cnki.sjg.2023.03.022

Affiliation of Author(s):电气工程学院

Funded by:自选课题

First Author:kuaisongyan

Co-author:朱启铭,王光亚,dengxianming,陈付豪

Indexed by:Journal paper

Document Code:5b5bb2948b2317e5018b28088c49135e

Volume:2023年03期:132-138+151,8

ISSN No.:1002-4956

Translation or Not:no

Date of Publication:2023-04-06