CN

黄飞

Associate researcher

Supervisor of Master's Candidates

E-Mail:

School/Department:碳中和研究院

Education Level:With Certificate of Graduation for Doctorate Study

Business Address:低碳院409#

Gender:Male

Contact Information:18361242820

Degree:Doctor

Status:在岗

Alma Mater:武汉理工大学

Discipline:Material Science
Material Physics and Chemistry
Material Process Engineering

Patents

Current position: Home > Scientific Research > Patents

一种半导体片材的表面缺陷及厚度检测方法及装置

Release time:2020-10-30 Hits:

Affilication of Author(s):碳中和研究院

Disigner of the Invention:yanaihua,赵辉,廖振华,尹诗斌,强颖怀,zhangshaoliang

Type of Patent:国内

State of Patent:专利授权

Application Number:201310542491.8

Number of Inventors:7

Service Invention or Not:no

Application Date:2013-11-05

Authorization Date:2015-11-04

First Author:huangfei

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Address:No1,Daxue Road,Xuzhou,Jiangsu,221116,P.R.China    Email: master@cumt.edu.cn
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