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一种半桥和全桥子模块混合的MMC模型预测控制方法
Release time:2022-02-28  Hits:

Affilication of Author(s):电气工程学院
Scope of patent:国内
School Sign:第一单位
Disigner of the Invention:daipeng
Type of Patent:Invent
State of Patent:Authorized patents
Application Number:201811196255.4
Number of Inventors:5
Service Invention or Not:no
Application Date:2017-10-15
Authorization Date:2020-05-15