中国矿业大学主页平台系统 daijianbo--Home-- Damage formation mechanisms of sintered silicon carbide during single-diamond grinding

戴剑博 Associate professor

戴剑博，中国矿业大学机电工程学院，工学博士，硕士生导师，美国密歇根大学访问学者。主要从事煤矿智能化开采技术与装备、煤矿特种环境机器人技术等热点领域的研究工作。主持及参与了国家自然科学基金项目、江苏省自然科学基金项目，中国博士后基金项目，科技部重点研发计划等多项课题。担任《Machines》期刊客座编辑，机械工程学报、Ceramics International，International Journal of Advanced Manufacturing Technology等期...Detials

Paper Publications Current position: Home > Scientific Research > Paper Publications

Damage formation mechanisms of sintered silicon carbide during single-diamond grinding

Release time:2023-08-25 Hits:

DOI number:10.1016/j.ceramint.2021.06.259
Affiliation of Author(s):机电工程学院
Funded by:其他课题
First Author:daijianbo
Co-author:Su, Honghua,wangzhongbin,Xu, Jiuhua,Fu, Yucan,Chen, Jiajia
Indexed by:Journal paper
Document Code:5b5bb2947da3abfc017db3f6ec5c50fc
Volume:卷: 47期: 20页: 28419-28428
ISSN No.:0272-8842
Translation or Not:no
Date of Publication:2021-10-15

Pre One: 多晶碳化硅陶瓷磨削裂纹损伤形成机理研究