软‑软接触式仿生关节制备工艺

Release time:2020-10-30 Hits:

Affilication of Author(s):材料与物理学院

Disigner of the Invention:Zhang Dekun,杨雪晖,xulinmin,wangqingliang,葛世荣

Type of Patent:国内

State of Patent:专利授权

Application Number:201710302585.6

Number of Inventors:6

Service Invention or Not:no

Application Date:2017-05-03

Authorization Date:2019-05-07

First Author:chenkai