Direct bonding of copper foil and liquid crystal polymer by laser etching and welding

Release time:2021-09-28 Hits:

DOI number:10.1016/j.optlaseng.2020.106509

Affiliation of Author(s):机电工程学院

Funded by:地市厅局（含县）项目

First Author:Jia, Le

Co-author:yanghaifeng,Wang, Yisai,Zhang, Baocai,liuhao,Jingbin Hao

Indexed by:Journal paper

Document Code:5b5bb2947983698901799d5e4e570cd7

Volume:卷: 139

ISSN No.:0143-8166

Translation or Not:no

Date of Publication:2021-04-01