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Computing method of thermal conductivity of heat dissipation vias in printed circuit board and its optimization

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Affiliation of Author(s):计算机科学与技术学院

Funded by:省、市、自治区科技项目

First Author:Xiao Shuo

Co-author:jianghaifeng

Indexed by:Journal paper

Document Code:paper_97771

Volume:41;1;14-19

ISSN No.:0305-6120

Translation or Not:no

Date of Publication:2015-01-14

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School/Department:计算机科学与技术学院

Business Address:中国矿业大学南湖校区，计算机学院

Gender:Male

Degree:Doctor

Academic Titles:教授

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