Congliang Huang

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Home > Scientific Research > Paper Publications

Thermal conductivity study of SiC nanoparticle beds for thermal insulation applications

Release time:2021-09-28 Hits:

DOI number:10.1016/j.physe.2020.113970
Affiliation of Author(s):电气与动力工程学院
Funded by:自选课题
First Author:Wu, Dongxu
Co-author:Congliang Huang
Indexed by:Journal paper
Document Code:5b5bb294752f6120017530d28ca90089
Volume:v 118,
ISSN No.:13869477
Translation or Not:no
Date of Publication:2020-04-01